Micron-Level Precision Semiconductor Packaging Molds & Spare Parts for Global Chip Packaging Factories

The semiconductor packaging industry has the strictest precision requirements among all machining sectors, where tiny dimensional deviations will lead to mass chip scrapping. Songben Xinke Precision develops and manufactures full sets of semiconductor encapsulation molds and matching precision spare parts, supporting global chip packaging, testing and semiconductor equipment manufacturers.

We adopt ultra-precision processing equipment including wire EDM, mirror EDM and high-speed graphite milling machines, achieving a processing tolerance as low as 0.001mm. Our main products cover SOP, DIP, QFN, DFN, BGA and IGBT encapsulation molds, cutting & forming molds, mold inserts, pressing fingers, material rails and wear-resistant cutting blades.

All mold core components use imported wear-resistant mold steel with mirror polishing treatment. Our technical team has decades of experience in semiconductor mold craft, capable of optimizing mold structure to reduce glue overflow and improve packaging yield for mass chip production.

Besides finished molds, we also produce matching spare parts for automatic packaging equipment: feeding sleeves, positioning pins, forming cutters and aging test fixture cores. We provide prototype trial mold production and mass mold manufacturing, with strict dust-free workshop inspection for all finished semiconductor components.

As the global semiconductor industry expands, stable high-precision mold supply becomes a key competitive advantage for packaging factories. We provide one-stop service from mold design, precision machining, surface finishing to final dimensional testing. Get in touch with our engineering team to discuss your semiconductor mold customization project.